The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 09, 2010

Filed:

Nov. 08, 2006
Applicants:

Judson S. Leonard, Newton, MA (US);

Matthew H. Reilly, Stow, MA (US);

Lawrence C. Stewart, Wayland, MA (US);

Washington Taylor, Cambridge, MA (US);

Inventors:

Judson S. Leonard, Newton, MA (US);

Matthew H. Reilly, Stow, MA (US);

Lawrence C. Stewart, Wayland, MA (US);

Washington Taylor, Cambridge, MA (US);

Assignee:

SiCortex, Inc., Maynard, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 12/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

Computer systems and methods using efficient module and backplane tiling to interconnect computer nodes via a Kautz-like digraph. A multinode computing system includes a large plurality of computing nodes interconnected via a Kautz topology having order O, diameter n, and degree k. The order equals (k+1)k. The interconnections from a node x to a node y in the topology satisfy the relationship y=(−x*k−j) mod O, where 1≦j≦k, and the computing nodes are arranged onto a plurality of modules. Each module has an equal plurality of computing nodes on it. A majority of the inter-node connections are contained on the plurality of modules and a minority of the inter-node connections are inter-module connections. Inter-module connections are routed among modules in parallel on an inter-module connection plane.


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