The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7660129 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 09, 2010

Filed:

Jan. 30, 2008
Applicants:

Yuuji Minota, Tokyo, JP;

Yasuhiro Fukutomi, Tokyo, JP;

Motonobu Koike, Yamanashi 401-0016, JP;

Inventors:

Yuuji Minota, Tokyo, JP;

Yasuhiro Fukutomi, Tokyo, JP;

Motonobu Koike, Yamanashi 401-0016, JP;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a printed circuit board in which a PCB and an FPC can be readily located, a solder connection structure and method between a printed circuit board and a flexible printed circuit board. The printed circuit boardincludes a plurality of padsfor mounting a flexible printed circuit board, wherein a solder resistis formed on the surface of the printed circuit board so as to expose the padsand convex portions are formed by insulation print layersaround the pads


Find Patent Forward Citations

Minota, Yuuji. (2010). Printed circuit board, solder connection structure and method between printed circuit board and flexible printed circuit board (U.S. Patent No. 7660129). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7660129

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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