The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Feb. 07, 2005
Applicants:
Min-kyo Cho, Seoul, KR;
Jae-cheon Doh, Chungcheongnam-do, KR;
Young-shin Kwon, Gyeonggi-do, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01);
U.S. Cl.
CPC ...
Abstract
In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.
Quick Actions:
Cho, Min-Kyo. (2010). Wiring substrate, solid-state imaging apparatus using the same, and manufacturing method thereof (U.S. Patent No. 7659936). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7659936
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