The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Nov. 08, 2006
Yoshitaka Kimura, Mihama-ku, JP;
Yoshitaka Kimura, Mihama-ku, JP;
Kawasaki Microelectronics, Inc., Mihama-ku, JP;
Abstract
A semiconductor integrated circuit having a multilayer wiring structure is provided which includes: a top metal wiring layer (M) including a plurality of top layer power supply wirings and a next-to-top metal wiring layer (M) directly below the top metal wiring layer Mincluding a plurality of next-to-top layer power supply wirings. Each of the top layer and the next-to-top layer power supply wirings also includes first potential wirings for supplying a first potential to the circuit elements and second potential wirings for supplying a second potential to the circuit elements. The top layer power supply wirings and the next-to-top layer power supply wirings cross each other and have a top layer insulating film disposed between them. First and second contacts are provided in the insulating film for connecting the first potential wirings and second potential wirings in the top and the next-to-top metal wiring layers with each other.