The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Sep. 19, 2006
Applicants:
Yoshihisa Negishi, Minami-Ashigara, JP;
Manjirou Watanabe, Minami-Ashigara, JP;
Inventors:
Yoshihisa Negishi, Minami-Ashigara, JP;
Manjirou Watanabe, Minami-Ashigara, JP;
Assignee:
Fujifilm Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/301 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a method for cutting a solid-state image pickup device of the present invention, a glass cover plate is diced with a surface thereof being protected, so that chipping of the glass cover plate can be significantly prevented. In addition, since a CCD wafer is adhered after the glass cover plate is diced, no glass fragments scattered due to chipping of the glass cover plate touch the CCD wafer, or cause damage to the CCD wafer, thereby a cutting of solid-state image pickup device can be achieved with high accuracy and high quality.