The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 09, 2010
Filed:
Mar. 31, 2005
Francisco Medina, El Paso, TX (US);
Ryan Wicker, El Paso, TX (US);
Jeremy A. Palmer, Albuquerque, NM (US);
Don W. Davis, Albuquerque, NM (US);
Bart D. Chavez, Albuquerque, NM (US);
Phillip L. Gallegos, Albuquerque, NM (US);
Francisco Medina, El Paso, TX (US);
Ryan Wicker, El Paso, TX (US);
Jeremy A. Palmer, Albuquerque, NM (US);
Don W. Davis, Albuquerque, NM (US);
Bart D. Chavez, Albuquerque, NM (US);
Phillip L. Gallegos, Albuquerque, NM (US);
Board of Regents, The University of Texas System, Austin, TX (US);
Sandia Corporation, Operator of Sandia National Laboratories, Albuquerque, NM (US);
Abstract
An integrated system and method of integrating fluid dispensing technologies (e.g., direct-write (DW)) with rapid prototyping (RP) technologies (e.g., stereolithography (SL)) without part registration comprising: an SL apparatus and a fluid dispensing apparatus further comprising a translation mechanism adapted to translate the fluid dispensing apparatus along the Z-, Y- and Z-axes. The fluid dispensing apparatus comprises: a pressurized fluid container; a valve mechanism adapted to control the flow of fluid from the pressurized fluid container; and a dispensing nozzle adapted to deposit the fluid in a desired location. To aid in calibration, the integrated system includes a laser sensor and a mechanical switch. The method further comprises building a second part layer on top of the fluid deposits and optionally accommodating multi-layered circuitry by incorporating a connector trace. Thus, the present invention is capable of efficiently building single and multi-material SL fabricated parts embedded with complex three-dimensional circuitry using DW.