The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2010

Filed:

Jun. 16, 2008
Applicants:

Eric Hung, San Jose, CA (US);

Geeta K. Desai, Saratoga, CA (US);

Vijendra Kuroodi, Cupertino, CA (US);

Alexander Miretsky, Mountain View, CA (US);

Mirko Vojnovic, Santa Clara, CA (US);

Inventors:

Eric Hung, San Jose, CA (US);

Geeta K. Desai, Saratoga, CA (US);

Vijendra Kuroodi, Cupertino, CA (US);

Alexander Miretsky, Mountain View, CA (US);

Mirko Vojnovic, Santa Clara, CA (US);

Assignee:

LSI Logic Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/00 (2006.01); G06F 1/04 (2006.01); G06F 12/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit is provided that includes an execution engine and a memory controller. The execution engine is clocked at a first rate and the memory controller is clocked at a second rate that is less than the first rate. Pins on the integrated circuit can transfer data to and from the integrated circuit on both the rising and falling edges of a second clock transitioning at the second clock rate. The integrated circuit is preferably packaged using a lead frame and wire bonds extending from pads on the integrated circuit to corresponding leads. The leads are secured to trace conductors on a surface of a printed circuit board. The board contains no more than two conductive layers separated by a dielectric layer. Thus, an overall electronic system is formed having a board with no more than two conductive layers, an execution engine that receives a first clock signal, a memory controller which receives a second clock signal, and a memory device that sends data to and from the memory controller at twice the rate of the second clock signal. Using a throttled second clock signal allows for less expensive packaging and mounting of packaged integrated circuits on a less expensive PCB, while still maintaining use of a DDR DRAM transfer mechanism.


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