The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Oct. 29, 2007
Charles C. Lee, Cupertino, CA (US);
David Q. Chow, San Jose, CA (US);
Abraham C. MA, Fremont, CA (US);
Frank Yu, Palo Alto, CA (US);
Ming-shiang Shen, Taipei Hsien, TW;
Horng-yee Chou, Superior, CO (US);
Charles C. Lee, Cupertino, CA (US);
David Q. Chow, San Jose, CA (US);
Abraham C. Ma, Fremont, CA (US);
Frank Yu, Palo Alto, CA (US);
Ming-Shiang Shen, Taipei Hsien, TW;
Horng-Yee Chou, Superior, CO (US);
Super Talent Electronics, Inc., San Jose, CA (US);
Abstract
An extended universal-serial bus (EUSB) bridge to a host computer can have peripheral component interconnect express (PCIE) protocol layers on one side of the bridge, and EUSB layers on the other side of the bridge, with a high-level bridging converter module connecting the upper layers. The PCIE physical, data-link, and transport layers may be eliminated by integrating the bridge with an I/O controller. PCIE requests and data payloads are directly sent to the bridge, rather than low-level PCIE physical signals. The PCIE data payloads are converted to EUSB data payloads by a high-level direct bridging converter module. Then the EUSB data payloads are passed down to an EUSB transaction layer, an EUSB data-link layer, and an EUSB physical layer which drives and senses physical electrical signals on both differential pairs of the EUSB bus.