The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2010

Filed:

May. 30, 2006
Applicants:

Carlos Dangelo, Los Gatos, CA (US);

Bala Padmakumar, Mountain View, CA (US);

Inventors:

Carlos Dangelo, Los Gatos, CA (US);

Bala Padmakumar, Mountain View, CA (US);

Assignee:

Nanoconduction, Inc., Menlo Park, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

An in-chip system and method for removing heat from integrated circuits is disclosed. One embodiment is a substrate with a front side and a back side. The front side of the substrate is capable of having formed thereon a plurality of transistors. A plurality of structures within the substrate contain a solid heat conductive media comprising carbon nanotubes and/or a metal, such as copper. At least some of the plurality of structures extend from the back side of the substrate into the substrate. In some embodiments, the carbon nanotubes are formed within the substrate using a catalyst.


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Dangelo, Carlos. (2010). In-chip structures and methods for removing heat from integrated circuits (U.S. Patent No. 7656027). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7656027

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