The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Jul. 07, 2008
Yoshiharu Ogata, Sakata, JP;
Yoshikatsu Soma, Sakata, JP;
Hiroharu Kondo, Sakata, JP;
Munehide Saimen, Suwa, JP;
Yoshiharu Ogata, Sakata, JP;
Yoshikatsu Soma, Sakata, JP;
Hiroharu Kondo, Sakata, JP;
Munehide Saimen, Suwa, JP;
Seiko Epson Corporation, , JP;
Abstract
A semiconductor device, includes: a wiring substrate having a wiring pattern on a front surface thereof; a first semiconductor chip mounted on the front surface of the wiring substrate; a first heat radiator having a first recess housing the first semiconductor chip and making contact with the front surface of the wiring substrate and the first semiconductor chip directly or with a first insulation layer; a second heat radiator making contact with a rear surface of the wiring substrate directly or with a second insulation layer; and a first fixing member passing through the first heat radiator, the wiring substrate, and the second heat radiator, and pressing the first heat radiator and the second heat radiator to the wiring substrate.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile