The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
May. 22, 2006
Kazuo Teshirogi, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Kazuo Teshirogi, Kawasaki, JP;
Yuzo Shimobeppu, Kawasaki, JP;
Kazuhiro Yoshimoto, Kawasaki, JP;
Yoshiaki Shinjo, Kawasaki, JP;
Fujitsu Microelectronics Limited, Tokyo, JP;
Abstract
A manufacturing method of a semiconductor device, includes i) a step of providing a transparent member above a main surface of a semiconductor substrate where a plurality of semiconductor elements is formed; ii) a first dividing step of dividing the transparent member corresponding to a designated area of the semiconductor element; iii) a second dividing step of dividing the transparent member corresponding to an external configuration of the semiconductor element; and iv) a dividing step of dividing the semiconductor substrate into the semiconductor elements corresponding to a dividing position of the transparent member.