The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2010

Filed:

Dec. 05, 2002
Applicants:

Johanna Lahti, Pori, FI;

Tapani Penttinen, Huutjärvi, FI;

Jari Räsänen, Imatra, FI;

Jurkka Kuusipalo, Tampere, FI;

Antti Savolainen, Kangasala, FI;

Inventors:

Johanna Lahti, Pori, FI;

Tapani Penttinen, Huutjärvi, FI;

Jari Räsänen, Imatra, FI;

Jurkka Kuusipalo, Tampere, FI;

Antti Savolainen, Kangasala, FI;

Assignee:

Stora Enso Oyj, Helsinki, FI;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61F 13/15 (2006.01);
U.S. Cl.
CPC ...
Abstract

The invention relates to a digital printing method and a paper or board applicable thereto. In digital printing, the surface of a paper or board is charged electrically, toner particles are brought to the surface in an electric field in accordance with the printing, and the particles are melted fast to the surface with the help of heat for forming the printing. According to the invention, the paper or board () is provided with a coating layer () containing an electrically chargeable acrylate copolymer of ethylene, which receives the toner that is fused to the coating with the help of infrared radiation. Suitable coating polymers are especially methyl, ethyl and butyl acrylate copolymers of ethylene (EMA, EEA and EBA). Especially in packaging boards, besides the digitally printable layer, the polymer coatings can comprise a water vapor or oxygen barrier layer for protecting the packed product, and a heat-sealable layer on the opposite side of the board for sealing the package.


Find Patent Forward Citations

Loading…