The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7654884 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 02, 2010

Filed:

Aug. 26, 2005
Applicants:

Kazuyuki Haneda, Ichihara, JP;

Yoshio Kawakami, Kawaguchi, JP;

Inventors:

Kazuyuki Haneda, Ichihara, JP;

Yoshio Kawakami, Kawaguchi, JP;

Assignee:

Showa Denko K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24B 31/00 (2006.01); B24B 7/19 (2006.01); G11B 5/712 (2006.01);
U.S. Cl.
CPC ...
Abstract

The object of the invention is to provide a method of polishing the end surfaces of a substrate for a recording medium, which is capable of efficiently polishing the inner peripheral end surface and/or the outer peripheral end surface of the substrate preventing the reliability of performance of the recording medium from being impaired by the adhesion of the residual polishing material. According to the invention, there is provided a method of polishing end surfaces of a substrate for a recording medium wherein an inner peripheral end surface or an outer peripheral end surface of a substrate for a disk-like recording medium having a circular hole at the central portion thereof is brought into contact with a polishing medium obtained by dispersing polishing grains in a viscoelastic resin carrier and the polishing medium flows, thereby to polish the inner peripheral end surface or the outer peripheral end surface.


Find Patent Forward Citations

Haneda, Kazuyuki. (2010). Method of polishing end surfaces of a substrate for a recording medium by a grain flow processing method (U.S. Patent No. 7654884). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7654884

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