The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
May. 10, 2005
Liang Jiang, Schenectady, NY (US);
Lawrence Bernard Kool, Clifton Park, NY (US);
Melvin Robert Jackson, Corea, ME (US);
Canan Uslu Hardwicke, Greenville, SC (US);
Ji-cheng Zhao, Latham, NY (US);
Ann Melinda Ritter, Niskayuna, NY (US);
Ching-pang Lee, Cincinnati, OH (US);
Liang Jiang, Schenectady, NY (US);
Lawrence Bernard Kool, Clifton Park, NY (US);
Melvin Robert Jackson, Corea, ME (US);
Canan Uslu Hardwicke, Greenville, SC (US);
Ji-Cheng Zhao, Latham, NY (US);
Ann Melinda Ritter, Niskayuna, NY (US);
Ching-Pang Lee, Cincinnati, OH (US);
General Electric Company, Niskayuna, NY (US);
Abstract
A method for evaluating the thermal exposure of a selected metal component which has been exposed to changing temperature conditions is described. The voltage distribution on a surface of the metal component, or on a metallic layer which lies over the component, is first obtained. The voltage distribution usually results from a compositional change in the metal component. The voltage distribution is then compared to a thermal exposure-voltage model which expresses voltage distribution as a function of exposure time and exposure temperature for a reference standard corresponding to the metal component. In this manner, the thermal exposure of the selected component can be obtained. A related device for evaluating the thermal exposure of a selected metal component is also described.