The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Mar. 20, 2006
Applicants:
Dirk Siepe, Dortmund, DE;
Reinhold Bayerer, Warstein, DE;
Andreas Lenniger, Anroechte, DE;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
The invention relates to a method and also a device and a system for bonding a semiconductor element (), in which various contact areas () of the semiconductor element () are successively connected to terminal areas () by means of bonding wire elements () and in which an electrical variable influenced by the semiconductor element () is acquired during the bonding operation.