The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 02, 2010

Filed:

Nov. 26, 2008
Applicants:

John Mackay, Sunnyvale, CA (US);

Tom Molinaro, Pleasant Hill, CA (US);

Inventors:

John MacKay, Sunnyvale, CA (US);

Tom Molinaro, Pleasant Hill, CA (US);

Assignee:

WSTP, LLC, San Clemente, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mask (stencil) having cells (openings) is disposed on a surface of a heater stage, and is then filled (printed) with solder paste. Then a substrate is assembled to the opposite side of the mask. Then the solder paste is reflowed. This may be done partially inverted. Then the mask is separated from the substrate, either before or after cooling. Solder balls are thus formed on the substrate, which may be a semiconductor wafer. A biased chuck urges the substrate into intimate contact with the mask. A method for printing the mask with solder paste is described. Methods of forming high aspect ratio solder bumps (including balls and reflowable interconnect structures) are described.


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