The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 02, 2010
Filed:
Jan. 08, 2008
Jee-soo Mok, Yongin-si, KR;
Jun-heyoung Park, Hwaseong-si, KR;
Ki-hwan Kim, Suwon-si, KR;
Sung-yong Kim, Suwon-si, KR;
Jee-Soo Mok, Yongin-si, KR;
Jun-Heyoung Park, Hwaseong-si, KR;
Ki-Hwan Kim, Suwon-si, KR;
Sung-Yong Kim, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method for manufacturing a printed circuit board having an embedded component is disclosed. The method includes: forming at least one contact bump and at least one electrode bump on one side of a base substrate; mounting the component such that the electrode bump is in correspondence with a contact terminal of the component; stacking an insulation layer, in which an opening is formed in correspondence to the component, on the one side of the base substrate, such that the contact bump penetrates the insulation layer; filling a filler in the opening; and stacking a metal layer on the insulation layer. Using the method, the reliability of circuit connections between the component and the circuit patterns can be improved, and the manufacturing process can be reduced in embedding the component in the printed circuit board.