The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Feb. 16, 2005
Naohiro Takahashi, Kawasaki, JP;
Naohiro Takahashi, Kawasaki, JP;
Fujitsu Microelectronics Limited, Tokyo, JP;
Abstract
Disclosed is a surface inspection device that performs a defect inspection throughout a surface of a wafer. In the defect detection using a defect review SEM, an X-Y coordinate system is set throughout a surface (excluding a round end face) of a product wafer to allow the inspection throughout the surface of the product wafer. Therefore, the defect detection can be performed also in an area other than an effective chip area. Further, the inspection results of the area are stored in relation to the coordinates in a position where the inspection results are acquired. Therefore, the inspection results can be effectively used for an analysis and a defect cause can be investigated with a higher degree of accuracy. As a result, the quality and yield of chips can be improved.