The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2010

Filed:

May. 22, 2008
Applicants:

Yutaka Inoue, Komoro, JP;

Yasuhisa Semba, Saku, JP;

Susumu Sorimachi, Komoro, JP;

Kouichi Kouzu, Komoro, JP;

Inventors:

Yutaka Inoue, Komoro, JP;

Yasuhisa Semba, Saku, JP;

Susumu Sorimachi, Komoro, JP;

Kouichi Kouzu, Komoro, JP;

Assignee:

Opnext Japan, Inc., Kanagawa, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 3/097 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A multibeam semiconductor laser diode having: an n-type semiconductor substrate; an n-type clad layer, an active layer, a p-type clad layer and a contact layer; a plurality of partitioning grooves extending from one end to the other end of the substrate and formed from the contact layer to a predetermined depth of the p-type clad layer; a stripe-shaped ridge sandwiched between two separation grooves; an insulating layer covering an area from each side wall of the contact layer of each ridge to an end of the partitioning region via the separation groove; a first electrode formed on a second plane of the substrate; and a second electrode formed in each partitioning region covering an area above the ridge, separation grooves and multilayer semiconductor layers outside the separation grooves, the second electrode being constituted of a lower second electrode layer and an upper second plated layer.


Find Patent Forward Citations

Loading…