The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Jun. 25, 2007
William K. Bischel, Menlo Park, CA (US);
David K. Wagner, San Jose, CA (US);
Harald Guenther, Los Gatos, CA (US);
Simon J. Field, Palo Alto, CA (US);
Markus P. Hehlen, Los Gatos, CA (US);
Richard B. Tompane, Los Altos, CA (US);
Andrew T. Ryan, Sunnyvale, CA (US);
C. Geoffrey Fanning, Hillsboro, OR (US);
Jim W. LI, Fremont, CA (US);
Nina D. Morozova, San Jose, CA (US);
William K. Bischel, Menlo Park, CA (US);
David K. Wagner, San Jose, CA (US);
Harald Guenther, Los Gatos, CA (US);
Simon J. Field, Palo Alto, CA (US);
Markus P. Hehlen, Los Gatos, CA (US);
Richard B. Tompane, Los Altos, CA (US);
Andrew T. Ryan, Sunnyvale, CA (US);
C. Geoffrey Fanning, Hillsboro, OR (US);
Jim W. Li, Fremont, CA (US);
Nina D. Morozova, San Jose, CA (US);
Gemfire Corporation, Fremont, CA (US);
Abstract
An optical assembly, such as a multiple output diode laser pump source for EDFAs, is formed by pressing an optical array emitter chip against a standoff structure protruding from a submount such that the emitter chip deforms to match the curvature of the standoff structure. An IO chip is also juxtaposed against the standoff structure such that its optical receivers can receive optical energy from the emitter chip. The IO chip can provide various optical functions, and then provide an optical array output for coupling into an optical fiber array. The standoff structure preferably contacts the emitter chip over an aggregate contact area much smaller than the area by which the emitter chip overlaps the submount. The materials used for bonding the emitter chip and the IO chip to the submount are disposed in the recesses between standoffs and not on the contact surfaces of the standoff structure.