The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Apr. 17, 2008
Yoshihiro Hisa, Tokyo, JP;
Tsutomu Yamaguchi, Tokyo, JP;
Takehiro Nishida, Tokyo, JP;
Kenji Hiramatsu, Tokyo, JP;
Yoshihiro Hisa, Tokyo, JP;
Tsutomu Yamaguchi, Tokyo, JP;
Takehiro Nishida, Tokyo, JP;
Kenji Hiramatsu, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
Semiconductor laser elements are formed on a common substrate. Au plating is formed on principal surfaces of the semiconductor laser elements. The semiconductor laser elements are mounted on a package with solder applied to the Au plating. Areas opposed to each other across a light-emitting area of each semiconductor laser element are designated first and second areas. Average thickness of the Au plating is different in the first and second areas of each semiconductor laser element.