The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Dec. 29, 2004
Applicants:
Sachin Navin Chheda, Roseville, CA (US);
Kirk Yates, Loomis, CA (US);
Nitin C. Bhagwath, Lincoln, CA (US);
Inventors:
Sachin Navin Chheda, Roseville, CA (US);
Kirk Yates, Loomis, CA (US);
Nitin C. Bhagwath, Lincoln, CA (US);
Assignee:
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor layer coupled lateral to the dielectric layer.