The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Dec. 25, 2003
Kei Hirata, Ibaraki, JP;
Koji Kitayama, Ibaraki, JP;
Mizuho Maeda, Ibaraki, JP;
Kuraray Co., Ltd., Kurashiki-shi, JP;
Abstract
An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.