The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Dec. 07, 2004
Yoshitsuga Morita, Chiba Prefecture, JP;
Katsutoshi Mine, Chiba Prefecture, JP;
Junji Nakanishi, Chiba Prefecture, JP;
Hiroji Enami, Chiba Prefecture, JP;
Yoshitsuga Morita, Chiba Prefecture, JP;
Katsutoshi Mine, Chiba Prefecture, JP;
Junji Nakanishi, Chiba Prefecture, JP;
Hiroji Enami, Chiba Prefecture, JP;
Dow Corning Toray Company, Ltd., Tokyo, JP;
Abstract
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing a semiconductor device into a mold and subjecting a curable silicone composition that fills the spaces between said mold and said semiconductor device to compression molding, wherein the curable silicone composition comprises the following components: (A) an organopolysiloxane having at least two alkenyl groups per molecule; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule; (C) a platinum-type catalyst; and (D) a filler, wherein either at least one of components (A) and (B) contains a T-unit siloxane and/or Q-unit siloxane. By the utilization this method, a sealed semiconductor device is free of voids in the sealing material, and a thickness of the cured silicone body can be controlled.