The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Jun. 08, 2006
IN Kyu You, Daejeon, KR;
Seung Youl Kang, Daejeon, JP;
Seong Deok Ahn, Daejeon, KR;
Gi Heon Kim, Daejeon, KR;
Ji Young OH, Daejeon, JP;
Chul AM Kim, Seoul, KR;
Kyu Ha Baek, Daejeon, KR;
Kyung Soo Suh, Daejeon, KR;
In Kyu You, Daejeon, KR;
Seung Youl Kang, Daejeon, JP;
Seong Deok Ahn, Daejeon, KR;
Gi Heon Kim, Daejeon, KR;
Ji Young Oh, Daejeon, JP;
Chul Am Kim, Seoul, KR;
Kyu Ha Baek, Daejeon, KR;
Kyung Soo Suh, Daejeon, KR;
Electronics and Telecommunications Research Institute, Daejeon, KR;
Abstract
A surface treatment method of an FRP substrate is provided. According to the method, an FRP substrate that is less deformed than a conventional flexible substrate material is used, and surface roughness, which is a drawback of the FRP substrate, is improved so that it may be applied to the fabrication of a device. In order to reduce the surface roughness of an FRP substrate, the FRP substrate is coated with an organic insulating solution and thereby planarized. Due to the reduced deformation and superior flatness, failures occurring due to misalignment in a photolithography process may be prevented.