The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2010

Filed:

Dec. 22, 2005
Applicants:

Takao Umeda, Hitachinaka, JP;

Osamu Machida, Hitachinaka, JP;

Jun Nagata, Hitachinaka, JP;

Inventors:

Takao Umeda, Hitachinaka, JP;

Osamu Machida, Hitachinaka, JP;

Jun Nagata, Hitachinaka, JP;

Assignee:

Ricoh Printing Systems, Ltd., Ibaraki-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B41J 2/04 (2006.01); H01L 41/22 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H04R 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of manufacturing an inkjet head, a silicon dioxide (SiO) layer is produced on the surface of first silicon member formed from single-crystal silicon. Next, a glass layer formed of borosilicate glass or the like is sputtered onto the surface of the silicon dioxide (SiO) layer. A silicon oxide (SiO, x<2) layer is then formed on the surface of a second silicon member. The first and second silicon members and are bonded together by applying heat at about 450° C. with heaters, as a DC voltage is applied across electrode terminals. As a result, a silicon dioxide (SiO) layer is formed at the interface of the glass layer and silicon oxide (SiO, x<2) layer, anodically bonding the two layers.


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