The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 26, 2010
Filed:
Nov. 27, 2006
Hiroyuki Asakura, Yokohama, JP;
Kiyoshi Imaizumi, Tokyo, JP;
Takeshi Iihara, Yokohama, JP;
Kazuyuki Takasawa, Kashiwa, JP;
Minoru Komada, Abiko, JP;
Hiroyuki Asakura, Yokohama, JP;
Kiyoshi Imaizumi, Tokyo, JP;
Takeshi Iihara, Yokohama, JP;
Kazuyuki Takasawa, Kashiwa, JP;
Minoru Komada, Abiko, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Abstract
A noncontact IC tagcomprises a base film, a noncontact IC circuitformed on the base film, and a plastic film or paper serving as a surfacing sheet, having a non-conductive, lustrous metal filmformed by deposition, laminated to the base filmon the side of the noncontact IC tag circuit. The surface roughness of the non-conductive, lustrous metal film, determined by atomic force microscopy, is more than 10 nm and 100 nm or less as indicated by the center line average height Ra. In the case where the non-conductive, lustrous metal filmis formed on the outer surface of the surfacing sheet, a concealing layermay further be formed on the inner surface of the surfacing sheetin order to enhance concealing properties.