The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2010

Filed:

Mar. 20, 2008
Applicants:

Kunihiro Koyama, Otsu, JP;

Muneyoshi Yamamoto, Moriyama, JP;

Takanori Uejima, Moriyama, JP;

Dai Nakagawa, Moriyama, JP;

Masaki Kimura, Yasu, JP;

Inventors:

Kunihiro Koyama, Otsu, JP;

Muneyoshi Yamamoto, Moriyama, JP;

Takanori Uejima, Moriyama, JP;

Dai Nakagawa, Moriyama, JP;

Masaki Kimura, Yasu, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A suction surface member is provided on an electronic component module including an electronic component base plate and surface mount device mounted on the electronic component base plate in order to provide a suction surface at a location that is substantially at the same level as or higher than that of an upper end of a transistor that is the tallest surface mount device. The suction head adheres to the suction surface to hold the electronic component module and the electronic component module is mounted on a motherboard defining the target board. Then a treatment is performed to prevent a situation in which an upper end of the suction surface member is higher than the upper end of the tallest surface mount device mounted on the electronic component base plate.


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