The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 26, 2010

Filed:

Jun. 16, 2005
Applicants:

Jung-hwan Woo, Chungcheongnam-do, KR;

Ho-jae Byon, Gyeonggi-do, KR;

Jae-bong Shin, Seoul, KR;

Yong-kyun Sun, Chungcheongnam-do, KR;

Hyun-ho Kim, Chungcheongnam-do, KR;

Choo-ho Kim, Gyeonggi-do, KR;

Youn-sung Ko, Chungcheongnam-do, KR;

Inventors:

Jung-Hwan Woo, Chungcheongnam-do, KR;

Ho-Jae Byon, Gyeonggi-do, KR;

Jae-Bong Shin, Seoul, KR;

Yong-Kyun Sun, Chungcheongnam-do, KR;

Hyun-Ho Kim, Chungcheongnam-do, KR;

Choo-Ho Kim, Gyeonggi-do, KR;

Youn-Sung Ko, Chungcheongnam-do, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); B21F 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.


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