The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7650584 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 19, 2010

Filed:

Aug. 14, 2007
Applicants:

Hitoshi Shiga, Yokohama, JP;

Kiyofumi Sakurai, Yokohama, JP;

Kenji Mima, Yokohama, JP;

Inventors:

Hitoshi Shiga, Yokohama, JP;

Kiyofumi Sakurai, Yokohama, JP;

Kenji Mima, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 9/45 (2006.01);
U.S. Cl.
CPC ...
Abstract

An ASIC includes a first-wire extended in a first-direction and a second-wire extended in a parallel direction to the first-wire and both are placed on a first-wire layer; and a third-wire placed on a second-wire layer above the first-wire layer and is extended above the wire and above the second-wire in a second-direction which intersects the first-direction and passing through a first via-hole is connected to the first-wire, and a fourth-wire separated from the third-wire extended in a parallel direction above the first-wire and above the second-wire and a fifth-wire separated from both the third-wire and the fourth-wire and extended in a parallel direction in a smallest space and passing through a second via-hole is connected to the second-wire, wherein, one end of the fifth-wire is extended to the center between the second-wire and the first-wire from above the second-wire.


Find Patent Forward Citations

Shiga, Hitoshi. (2010). Application specific semiconductor integrated circuit and its manufacturing method thereof (U.S. Patent No. 7650584). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7650584

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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