The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Jul. 09, 2007
Jun Tsukano, Kawasaki, JP;
Kenta Ogawa, Kawasaki, JP;
Takehiko Maeda, Kawasaki, JP;
Shintaro Yamamichi, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
Jun Tsukano, Kawasaki, JP;
Kenta Ogawa, Kawasaki, JP;
Takehiko Maeda, Kawasaki, JP;
Shintaro Yamamichi, Tokyo, JP;
Katsumi Kikuchi, Tokyo, JP;
NEC Electronics Corporation, Kanagawa, JP;
NEC Corporation, Tokyo, JP;
Abstract
A wiring substrate includes a base insulating film, a first interconnection formed on a top surface side of the base insulating film, a via conductor provided in a via formed in the base insulating film, and a second interconnection provided on a bottom surface side of the base insulating film. The second interconnection is connected to the first interconnection via the via. The wiring substrate includes divided-substrate-unit regions, in each of which the first interconnection, the via, and the second interconnection are formed. The wiring substrate includes a warpage-controlling pattern on the base insulating film, with a warped shape such that when the wiring substrate rests on a horizontal plate, at least a central part of a plane surface of the substrate contacts the horizontal plate, with both ends of the side raised.