The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Jan. 10, 2006
Applicant:
Hyung-gil Baek, Suwon-si, KR;
Inventor:
Hyung-Gil Baek, Suwon-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
A stack package may have a plurality of unit packages. Each unit package may include a first substrate, a semiconductor chip, and a second substrate. Conductive supports may stack the second substrate on the first substrate. Conductive bumps may be provided on the bottom surface of the first substrate. An encapsulant may seal the semiconductor chip exposing the top surface of the second substrate. The conductive bumps of an upper unit package may be connected to the second substrate of the lower unit package.