The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
May. 04, 2006
Arthur R. Zingher, Mountain View, CA (US);
Bruce M. Guenin, San Diego, CA (US);
Ronald Ho, Mountain View, CA (US);
Robert J. Drost, Los Altos, CA (US);
Arthur R. Zingher, Mountain View, CA (US);
Bruce M. Guenin, San Diego, CA (US);
Ronald Ho, Mountain View, CA (US);
Robert J. Drost, Los Altos, CA (US);
Sun Microsystems, Inc., Santa Clara, CA (US);
Abstract
One embodiment of the present invention provides a system that facilitates high-bandwidth communication using a flexible bridge. This system includes a chip with an active face upon which active circuitry and signal pads reside, and a second component with a surface upon which active circuitry and/or signal pads reside. A flexible bridge provides high-bandwidth communication between the active face of the chip and the surface of the second component. By matching the wire line size in the flexible bridge to the size of circuits and/or signal pads on the chip and on the second component, the system allows signals to be sent between the circuits on the chip and the second component without having to change the scale of the interconnect, thereby alleviating wireability and bandwidth limitations of conventional chip packaging technologies.