The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Jul. 14, 2006
Masanari Matsuura, Chiryu, JP;
Masahiro Koizumi, Kumamoto, JP;
Masaya Tsuruta, Kumamoto, JP;
Tomoyuki Kubota, Yatsushiro, JP;
Yoshiyuki Nakamura, Fussa, JP;
Masanari Matsuura, Chiryu, JP;
Masahiro Koizumi, Kumamoto, JP;
Masaya Tsuruta, Kumamoto, JP;
Tomoyuki Kubota, Yatsushiro, JP;
Yoshiyuki Nakamura, Fussa, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota-shi, JP;
Hirata Corporation, Shinagawa-ku, JP;
Nihon Den-Netsu Keiki Co., Ltd., Ota-ku, JP;
Abstract
The present invention provides technology that uniformly heats and melts a plurality of solder material arranged in a plurality of locations on a board, and uniformly solders a plurality of parts to the board that are arranged in a plurality of locations on the board. A soldering apparatus includes an induction coil having a length in the longitudinal direction that is longer than the length of the board. An inner space having a size sufficient to arrange the board therein is maintained inside the induction coil. The board supporting the parts and the solder material will be positioned in the approximate center of the inner space of the induction coil. An alternating current will flow through the induction coil in this state. An alternating magnetic field will be generated in the inner space of the induction coil. Magnetic fluxes will substantially uniformly pass through the inner space of the induction coil along the longitudinal direction of the induction coil. In this way, the plurality of solder material arranged on a plurality of locations on the board may be uniformly heated and melted. The plurality of parts arranged on a plurality of locations on the board may be uniformly soldered to the board because the plurality of solder material may be uniformly heated and melted due to magnetic fluxes that uniformly passing through the board.