The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 19, 2010

Filed:

Jan. 25, 2008
Applicants:

Myung-sun Moon, Daejeon, KR;

Min-jin Ko, Daejeon, KR;

Hye-yeong Nam, Cheongju, KR;

Jung-won Kang, Seoul, KR;

Bum-gyu Choi, Daejeon, KR;

Byung-ro Kim, Daejeon, KR;

Gwi-gwon Kang, Daejeon, KR;

Young-duk Kim, Daejeon, KR;

Sang-min Park, Daejeon, KR;

Inventors:

Myung-Sun Moon, Daejeon, KR;

Min-Jin Ko, Daejeon, KR;

Hye-Yeong Nam, Cheongju, KR;

Jung-Won Kang, Seoul, KR;

Bum-Gyu Choi, Daejeon, KR;

Byung-Ro Kim, Daejeon, KR;

Gwi-Gwon Kang, Daejeon, KR;

Young-Duk Kim, Daejeon, KR;

Sang-Min Park, Daejeon, KR;

Assignee:

LG Chem, Ltd., Seoul, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G12B 21/02 (2006.01); H01L 21/20 (2006.01); H01L 21/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a coating composition for insulating film production, a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device comprising the same, and more particularly to a coating composition for insulating film production having a low dielectric constant and that is capable of producing an insulating film with superior mechanical strength (elasticity), a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device comprising the same. The coating composition of the present invention comprises an organic siloxane resin having a small molecular weight, and water, and significantly improves low dielectricity and mechanical strength of an insulating film.


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