The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Jan. 24, 2006
Thierry Barge, Grenoble, FR;
Walter Schwarzenbach, Saint-Nazaire-les-Eymes, FR;
Jean-marc Waechter, Saint-Vincent-de-Mercuze, FR;
Thuan Truong, Domène, FR;
Bruno Ghyselen, Seyssinet-Pariset, FR;
Thierry Barge, Grenoble, FR;
Walter Schwarzenbach, Saint-Nazaire-les-Eymes, FR;
Jean-Marc Waechter, Saint-Vincent-de-Mercuze, FR;
Thuan Truong, Domène, FR;
Bruno Ghyselen, Seyssinet-Pariset, FR;
S.O.I.Tec Silicon on Insulator Technologies, Bernin, FR;
Abstract
The invention relates to a method of splitting apart a substrate of two adjoining wafers defining between them a cleavage plane, by bringing each substrate into a substrate-receiving space; and clamping first and second jaw portions onto each substrate in such a manner as to hold each substrate and urge apart the two wafers of each substrate by co-operation between the shapes of housings in first and second portions of the two jaws, respectively. The invention also relates to a splitting method that includes bringing each substrate into a substrate-reception space; clamping together separator portions onto each substrate so as to split apart the two wafers of each substrate; and clamping the split-apart substrate wafers so as to hold the wafers together. An automated system for processing multiple substrates is also provided.