The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Jun. 19, 2007
Jinbang Tang, Chandler, AZ (US);
Jong-kai Lin, Chandler, AZ (US);
Jinbang Tang, Chandler, AZ (US);
Jong-Kai Lin, Chandler, AZ (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate () (e.g., chip carrier) has an adhesive layer (), where electronic components () are attached. An insulating layer () is formed over the plurality of electronic components, and a conductive encapsulant structure () is formed over the insulating layer. The adhesive layer is detached from the electronic components, and multi-layer circuitry () is formed over, and in electrical communication with, the plurality of electronic components. A shielding via () is formed through the multilayer circuitry such that it contacts the conductive encapsulant.