The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 19, 2010
Filed:
Mar. 13, 2006
Applicants:
Katsumasa Hasegawa, Tokyo, JP;
Kuniteru Mihara, Tokyo, JP;
Katsuhiko Uda, Tokyo, JP;
Takashi Miyoshi, Tokyo, JP;
Inventors:
Katsumasa Hasegawa, Tokyo, JP;
Kuniteru Mihara, Tokyo, JP;
Katsuhiko Uda, Tokyo, JP;
Takashi Miyoshi, Tokyo, JP;
Assignee:
Furukawa Electric Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01);
U.S. Cl.
CPC ...
Abstract
A high-strength, high conductivity copper alloy wire that is excellent in resistance to stress relaxation, which contains 1.0 to 4.5% by mass of Ni, 0.2 to 1.1% by mass of Si, 0.05 to 1.5% by mass of Sn, and less than 0.005% (including zero) by mass of S, with the balance being Cu and inevitable impurities, wherein the wire has a conductivity of from 20% to 60% IACS and a tensile strength of from 700 to 1,300 MPa, and a method of producing the same.