The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2010

Filed:

Sep. 20, 2006
Applicant:

Yoshiki Takayama, Shiga, JP;

Inventor:

Yoshiki Takayama, Shiga, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 5/335 (2006.01); H01L 23/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a package including a base fixed with a solid image pickup element, a side wall rising up along the periphery of the base, and internal terminals arranged on a step of the side wall, a plurality of recesses are formed at certain intervals in a lower part of the step to prevent bleeding of an adhesive fixing the solid image pickup element from creeping up over the internal terminals. When the adhesive and bleeding thereof spread around the solid image pickup element during die bonding, they flow into the recesses, making even fast-flowing bleeding hardly creep up an inner surface of the side wall including the step, and enabling prevention of the adhesive from adhering to the internal terminal. Strength, questioned by the presence of the recesses upon wire bonding, can be secured by residual parts between the recesses, and defective wire bonding is less likely to occur.


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