The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Feb. 28, 2006
Applicants:
Harry Hedler, Germering, DE;
Roland Irsigler, Munich, DE;
Thorsten Meyer, Regensburg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/12 (2006.01); H01L 23/053 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a semiconductor module having: a semiconductor device () having a contact device () for making electrical contact with a connection device () via a rewiring device (″); and a carrier device () for mechanically coupling the semiconductor device () to a connection device (), the carrier device () having a gradient between a first modulus of elasticity at the semiconductor device () and a second, higher modulus of elasticity at the connection device (). The present invention likewise provides a method for producing a semiconductor module.