The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2010

Filed:

Apr. 27, 2006
Applicant:

Hiroshi Murai, Aizuwakamatsu, JP;

Inventor:

Hiroshi Murai, Aizuwakamatsu, JP;

Assignee:

Spansion LLC, Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes bit lines () provided in a semiconductor substrate (), word lines () provided above the bit lines and running in a width direction of the bit lines (), metal lines () provided above the word lines () and running in a length direction of the bit lines (), and bit line contact regions () running in the length direction of the word lines () and located between word line regions () in which a plurality of word lines () are disposed. Each of the bit lines () is connected with every other metal line () in the bit line contact regions (). It is thus possible to provide a semiconductor device and a fabrication method therefor in which an alignment margin can be ensured between a contact hole () and the bit line () to enable downsizing of a memory cell.


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