The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Sep. 17, 2008
Manuel Fendler, Grenoble, FR;
Abdenacer Ait-mani, Saint Egreve, FR;
Alain Gueugnot, Sassenage, FR;
Francois Marion, Saint-Martin le Vinoux, FR;
Manuel Fendler, Grenoble, FR;
Abdenacer Ait-Mani, Saint Egreve, FR;
Alain Gueugnot, Sassenage, FR;
Francois Marion, Saint-Martin le Vinoux, FR;
Commissariat a l'Energie Atomique, Paris, FR;
Abstract
The invention concerns a method of collective bonding of individual chips on a strained substrate (), which comprises the following steps: functionalised layers () are arranged on a support (), in an adjacent non-contiguous manner, with a space e between two neighboring layers (), a calibrated drop of adhesive () is deposited on each of these functionalised layers, the strained substrate () is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularized to produce chips () bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.