The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Dec. 21, 2007
Benjamin N. Eldridge, Danville, CA (US);
Gary W. Grube, Pleasanton, CA (US);
Ken S. Matsubayashi, Fremont, CA (US);
Richard A. Larder, Livermore, CA (US);
Makarand S. Shinde, Livermore, CA (US);
Gaetan L. Mathieu, Vareness, CA (US);
Benjamin N. Eldridge, Danville, CA (US);
Gary W. Grube, Pleasanton, CA (US);
Ken S. Matsubayashi, Fremont, CA (US);
Richard A. Larder, Livermore, CA (US);
Makarand S. Shinde, Livermore, CA (US);
Gaetan L. Mathieu, Vareness, CA (US);
FormFactor, Inc., Livermore, CA (US);
Abstract
The present invention discloses a method and system compensating for thermally induced motion of probe cards used in testing die on a wafer. A probe card incorporating temperature control devices to maintain a uniform temperature throughout the thickness of the probe card is disclosed. A probe card incorporating bi-material stiffening elements which respond to changes in temperature in such a way as to counteract thermally induced motion of the probe card is disclosed including rolling elements, slots and lubrication. Various means for allowing radial expansion of a probe card to prevent thermally induced motion of the probe card are also disclosed. A method for detecting thermally induced movement of the probe card and moving the wafer to compensate is also disclosed.