The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2010

Filed:

Nov. 30, 2005
Applicants:

Wendy L. Wilkins, Rochester, MN (US);

Barry K. Gilbert, Rochester, MN (US);

Bruce R. Kline, Winona, MN (US);

Inventors:

Wendy L. Wilkins, Rochester, MN (US);

Barry K. Gilbert, Rochester, MN (US);

Bruce R. Kline, Winona, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/46 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a supercritical fluid that transports heat from the devices to a heat sink in thermal contact with the enclosure.


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Wilkins, Wendy. (2010). Packaging for high power integrated circuits (U.S. Patent No. 7642644). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7642644

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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