The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Oct. 13, 2006
Sang-wook Park, Seongnam-si, KR;
Hyung-gil Baek, Suwon-si, KR;
Sang-Wook Park, Seongnam-si, KR;
Hyung-Gil Baek, Suwon-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A stack package may include a plurality of individual packages arranged in a stack. Each individual package may have a circuit substrate disposed on the upper and lower surfaces of a semiconductor chip. Through bonding wires, a lower circuit substrate may be electrically connected to the semiconductor chip, and an upper circuit substrate may be electrically connected to the lower circuit substrate. An upper package in the stack may be mechanically and electrically connected to the upper circuit substrate of a lower package in the stack through conductive bumps. The semiconductor chip may be surrounded by the upper and the lower circuit substrates, and molding resins. The individual packages may have the same conductive bump layout.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile