The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2010

Filed:

Mar. 29, 2005
Applicants:

Koji Tsuji, Osaka, JP;

Yoshiharu Sanagawa, Osaka, JP;

Masao Kirihara, Osaka, JP;

Kazuo Gouda, Osaka, JP;

Youichi Nishijima, Osaka, JP;

Inventors:

Koji Tsuji, Osaka, JP;

Yoshiharu Sanagawa, Osaka, JP;

Masao Kirihara, Osaka, JP;

Kazuo Gouda, Osaka, JP;

Youichi Nishijima, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/14 (2006.01); H01L 29/82 (2006.01); H01L 29/84 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sensor system includes a sensor device () and an integrated circuit () for driving the device (). The device () includes a sensor body () of a silicon-based material, an upper sealing member () of a silicon-based material, and a lower sealing member () of a silicon-based material. The upper sealing member () and the lower sealing member () are joined together to cooperatively house the body () therewithin in an airtight manner. The device () and the circuit () are formed as a stacked body. The body () is electrically connected to a wiring pattern () of the circuit () through a conductive through-path () penetrating the upper sealing member () and a mounting electrode () provided on an outer surface of the upper sealing member (). The device () is connected to an MID substrate () through the circuit ().


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