The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Dec. 24, 2004
Masaru Takaishi, Kyoto, JP;
Masaru Takaishi, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A production method for a semiconductor device, including the steps of: forming a semiconductor layer of the first conductivity on the semiconductor substrate; forming a trench in the semiconductor layer, the trench penetrating through the semiconductor layer to reach the semiconductor substrate; filling a filling material in a predetermined bottom portion of the trench, so that a filling material portion is provided in the bottom portion of the trench up to a predetermined upper surface position which is shallower than an interface between the semiconductor substrate and the semiconductor layer; and, after the filling step, introducing an impurity of the second conductivity into a portion of the semiconductor layer exposed to an interior side wall of the trench.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile