The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Dec. 17, 2007
Applicant:
Steve Xin Liang, San Diego, CA (US);
Inventor:
Steve Xin Liang, San Diego, CA (US);
Assignee:
Skyworks Solutions, Inc., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A thermal mechanical process for bonding a flip chip die to a substrate. The flip chip die includes a plurality of copper pillar bumps, each copper pillar bump of the plurality of copper pillar bumps having a copper portion attached to the die and a bonding cap attached to the copper portion. The process includes positioning the die on the substrate such that the bonding cap of each copper pillar bump of the plurality of copper pillar bumps contacts a corresponding respective one of a plurality of bonding pads on the substrate, and thermosonically bonding the die to the substrate.