The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Dec. 13, 2001
Kouichi Hashimoto, Osaka, JP;
Takahiro Fukuoka, Osaka, JP;
Koji Akazawa, Osaka, JP;
Yoshio Nakagawa, Osaka, JP;
Tatsuya Kubozono, Osaka, JP;
Kouichi Hashimoto, Osaka, JP;
Takahiro Fukuoka, Osaka, JP;
Koji Akazawa, Osaka, JP;
Yoshio Nakagawa, Osaka, JP;
Tatsuya Kubozono, Osaka, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.