The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2010
Filed:
Jul. 07, 2005
Masahide Tamura, Toyama, JP;
Masato Ando, Toyama, JP;
Yuichi Ishikuro, Toyama, JP;
Hokuriku Electric Industry Co., Ltd., Toyama-shi, JP;
Abstract
A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrateis joined onto a wall surface of the casingthat defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surfaceof the semiconductor integrated circuit substrate. A shock absorbing layer is formed on the front surfaceof the semiconductor integrated circuit substrateat least on a part thereof facing the weightof the semiconductor sensor element, for suppressing the bouncing of the weightwhen the weightcollides against the semiconductor integrated circuit substrate